Systems Architecture

Download Design for High Performance, Low Power, and Reliable 3D by Sung Kyu Lim PDF

By Sung Kyu Lim

This e-book offers readers with numerous algorithms and software program instruments, devoted to the actual layout of through-silicon-via (TSV) established, third-dimensional built-in circuits. It describes a variety of “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs constructed with the instruments lined within the e-book. This e-book also will characteristic sign-off point research of timing, energy, sign integrity, and thermal research for 3D IC designs. complete info of the similar algorithms might be supplied in order that the readers might be capable not just to understand the middle mechanics of the actual layout instruments, but additionally as a way to reproduce and enhance upon the implications themselves. This e-book also will supply a number of design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) innovations which are thought of severe to the actual layout process.

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