Systems Architecture

Download Design-for-Test and Test Optimization Techniques for by Brandon Noia,Krishnendu Chakrabarty PDF

By Brandon Noia,Krishnendu Chakrabarty

This booklet describes cutting edge innovations to deal with the trying out wishes of 3D stacked built-in circuits (ICs) that make the most of through-silicon-vias (TSVs) as vertical interconnects. The authors establish the main demanding situations dealing with 3D IC trying out and current effects that experience emerged from state-of-the-art study during this area. assurance comprises themes starting from die-level wrappers, self-test circuits, and TSV probing to test-architecture layout, try scheduling, and optimization. Readers will reap the benefits of an in-depth examine test-technology strategies which are had to make 3D ICs a fact and commercially achievable.

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