Systems Architecture

Download Designing TSVs for 3D Integrated Circuits (SpringerBriefs in by Nauman Khan,Soha Hassoun PDF

By Nauman Khan,Soha Hassoun

This ebook explores the demanding situations and provides top recommendations for designing Through-Silicon Vias (TSVs) for 3D built-in circuits.  It describes a unique strategy to mitigate TSV-induced noise, the GND Plug, that's improved to others tailored from 2-D planar applied sciences, resembling a bottom floor aircraft and standard substrate contacts. The e-book additionally investigates, within the type of a comparative research, the effect of TSV dimension and granularity, spacing of C4 connectors, off-chip strength supply community, shared and committed TSVs, and coaxial TSVs at the caliber of energy supply in 3D ICs. The authors supply certain most sensible layout practices for designing 3D energy supply networks.  considering that TSVs occupy silicon real-estate and effect gadget density, this booklet presents 4 iterative algorithms to reduce the variety of TSVs in an influence supply community. in contrast to different current equipment, those algorithms may be utilized in early layout phases whilst purely useful block- point behaviors and a floorplan can be found. ultimately, the authors discover using Carbon Nanotubes for energy grid layout as a futuristic substitute to Copper.

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